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Helion signs letter of intent for $175 million CHIPS award

Helion said Thursday it signed a letter of intent with the Commerce Department for up to $175 million in CHIPS Act funding, plus $50 million in private investment, for high-voltage semiconductors used in its fusion plants.

What's new
  1. New headline Was: “Fusion startup Helion is developing new semiconductors that could double output of its power plants”
  2. Our desk filed its story

Primary source: Helion announcement

Helion, a fusion company based in Everett, Washington, said Thursday it signed a letter of intent with the U.S. Department of Commerce for up to $175 million in funding through the CHIPS Research and Development Office, along with $50 million in additional private investment1,2.

The company said the money would support research, development, and manufacturing of high-voltage semiconductors and power electronics used in its pulsed fusion systems1,2. TechCrunch, citing co-founder and chief executive David Kirtley, reported that current devices lose about 5% to 10% of the electricity that flows through them, and that cutting those losses in half would double the fusion system's power output1.

Helion's statement described the federal money as an expected award under a letter of intent, not a closed contract2. Upon a definitive award agreement, the company said the Commerce Department would receive a $175 million non-voting interest in Helion based on its most recent Series G preferred-stock valuation2.

More than $100 million would support semiconductor and advanced-packaging work in Washington state, Helion said, and would bring more than 100 jobs and power-module manufacturing capability there2. About $80 million would support tooling, design, and process development in Burlington, Vermont; TechCrunch, citing Kirtley, named GlobalFoundries as the partner, while Helion's release referred only to an industry partner1,2.

Helion said semiconductors that meet its pulsed-power needs are currently available only from overseas manufacturers2. Kirtley told TechCrunch there are no U.S. manufacturers of the class of device Helion plans to make, and that a production line in Washington state would be the first in the United States for that class1.

The three-year award is under the CHIPS Act, TechCrunch reported1. Kirtley told the outlet the funded research would not make it into Orion, Helion's first plant, in time for a 2028 deadline to supply Microsoft with electricity, because federal contracts can take months to negotiate, but that later plants could be more efficient1.

Helion harvests electricity directly from fusion reactions rather than heating steam to drive a turbine, TechCrunch reported, so power-electronics efficiency is central to its design1. Commerce Secretary Howard Lutnick, quoted in Helion's release, said the investment expands domestic research and supply chains2. Bill Frauenhofer of the Commerce Department said the work would support power conversion for defense, grid transmission, and advanced energy generation1,2. Kirtley told TechCrunch Helion's main focus remains putting power on the grid1.

No other independent news outlet had confirmed the announcement at the time of writing beyond TechCrunch's report and Helion's own statement1,2. The investor behind the $50 million private round was not disclosed1,2.

Sources

  1. TechCrunchFusion startup Helion is developing new semiconductors that could double output of its power plants
  2. Helion (press release)Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D To Support Fusion Energy

How it’s being reported

2 versions from 1 source

Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D To Support Fusion Energy

Frames the deal as a letter of intent and a boost to U.S. high-voltage semiconductor manufacturing.

Company statement describing a letter of intent for up to $175 million plus $50 million private capital, jobs in Everett, and a possible Commerce equity interest.

Leaves out Does not name GlobalFoundries; TechCrunch does, citing Kirtley.